BOND TECHNOLOGY (S) PRIVATE LIMITED (200309938M)

BOND TECHNOLOGY (S) PRIVATE LIMITED is a Sole Proprietorship/ Partnership registered in Singapore under the Unique Entity Number (UEN) 200309938M. The company operates as a Private Company Limited by Shares and is currently listed as a Struck Off.

Company Overview

BOND TECHNOLOGY (S) PRIVATE LIMITED was incorporated on October, 05 2003 and is regulated by the ACRA. The UEN was officially issued on October, 05 2003.

• Company Name: BOND TECHNOLOGY (S) PRIVATE LIMITED
• Unique Entity Number (UEN): 200309938M
• Issuance Agency: ACRA
• Entity Type: Local Company
• Company Type: Private Company Limited by Shares
• Company Status: Struck Off
• Number of Officers: 2

Registered Business Address

The registered business address of BOND TECHNOLOGY (S) PRIVATE LIMITED is classified as a LOCAL address and is located at:

Business Classification & Activities

BOND TECHNOLOGY (S) PRIVATE LIMITED is registered under the Singapore Standard Industrial Classification (SSIC) code 46900 - Wholesale trade of a variety of goods without a dominant product.

Statutory & Compliance Information

• Account Due Date: May, 06 2005
• Annual Return Filing Date: N/A

Audit & Governance

Based on publicly available records, no audit firm information has been disclosed.

Additional Corporate Information

• Business Constitution: N/A
• PAF Constitution: N/A